Electronic Zone Cooling

The Company has a new Patented, ''Pressurized Air Zone Cooling'' Technology''.

The Company has a new Patented, ''Pressurized Air Zone Cooling'' Technology''. The Company's Technology has the potential to replace ''FANS'' as the dominant part used to cool Electronic products. The Products are: 1. ''Miniature Super Air Pump'' - has the pressure to push air through small 1/8''-3/8'' plastic tubes to the hot components. It can replace 6 fans in a typical application. 2. ''Micro Channel Heat Sinks'' - The Fin Spacing is 10 Thousandth of an Inch apart. This creates a large surface area in a small space. The Micro Channel Heat Sink is 50 - 100 times smaller than a typical heat sink used today. 3. Hardware to connect the Super Air Pump to the heat sinks which are tubes, clips, brackets, and manifolds to split the air between multiple tubes. 4. An Automatic version, which includes a Microprocessor Controller Board. Thermistors are mounted on each hot component and each tube will include a Piezoelectric Valve to control the air flow. In this version, the Design Engineer specifies a set temperature and a maximum temperature for each component. The Controller Board adjusts the valves to provide the air required to maintain the set temperature. If the temperature starts to rise, the Controller Board will open the valve for that component and send more air. If still more air is required, the Controller Board will speed up the Air Pump Motor to increase the overall air flow in the system.