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Named an IBM Fellow in 2009, the highest honor a scientist, engineer, or programmer at IBM can achieve, he is an internationally recognized expert in the fields of electronic cooling and data center thermal management. With over 30 years of experience in engineering and engineering management in the thermal design of IBM’s large-scale computers at the Systems and Technology Group, Poughkeepsie, New York, he has made sustained contributions in cooling IBM's supercomputers, high performance servers, client/servers, parallel processors and test equipment through the innovative use of air, water and refrigerants. . Under his guidance, a consortium of leaders in data center thermal management was formed. He was inducted into the prestigious National Academy of Engineering (NAE) in 2005. In recognition of his accomplishments and leadership, IBM appointed him as IBM's Chief Engineer for Data Center Energy Efficiency. He is also an IBM Academy of Technology Member and ASME Fellow. He is a member of ASME’s Heat Transfer Division and an active member of the K-16 Electronic Cooling Committee. He has been an Associate Editor of the Journal of Electronic Packaging and an Associate Editor of the ASHRAE Research Journal and is now an Associate Editor of the ASME Journal of Heat Transfer. He has extensively taught Mechanical Engineering courses for prospective Professional Engineers and has given seminars on electronic cooling at a number of universities. He is a past Chair of the ASHRAE TC9.9 committee on Mission Critical Facilities, Technology Spaces, and Electronic Equipment. In addition, he has published more than 100 technical papers and with more than 100 patents in the area of electronic cooling (granted or pending).
Noted For:Prolific contributor in cooling IBM's supercomputers, high performance servers, client/servers, and other equipment through the innovative use of air, water and refrigerants
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