DSG Technologies

DSG Technologies develops low temperature microwave heating and curing systems for thermal processing and thin-film deposition.

DSG Technologies, Inc. engages in the development and manufacture of low temperature microwave heating and curing systems for thermal processing and thin-film deposition utilizing micro-mode microwave (M3) heating technology in front-end integrated circuit fabrication in the United States, Europe, and Asia. It offers AXOM-200/300, an M3 batch cold wall reaction chamber that serves low temperature ozone oxidation, cu annealing, polyimide/BCB cure, high-k annealing, low-k dielectrics annealing, ultra low temperature LPCVD, and MEMS annealing applications in the semiconductor industry. The company was formerly known as DSGI Technologies Inc. DSG Technologies, Inc. was incorporated in 2004 and is headquartered in Morgan Hill, California.